マイクロデバイスのダイシング方法の検討
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概要
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A wafer of the microdevices is usually cut into the chips by the dicing process after 3D-microstructures and circuit patterns are built on both faces of it by Si-micromachining process. However, unlike LSI’s, the microdevices have some factors, such as the deep pattern on both faces, which make the dicing process hard and sometimes cause the defective ones. Taking the case of a micro-probe, one kind of microdevice, applied for testing LSI’s, we clarified the problems in the dicing process, such as incomplete electric isolation of each probe, stain and big chippings, peeling of circuit layer, and tight tolerance in dimensions. We studied out the new dicing method to solve these problems by optimizing the thickness of the circuits and the dicing blades, applying a cutting to both faces, making a non-adhesive areas in the dicing tape facing the circuit pattern areas on the wafer, forming a cutting area on the wafer. We think these studies can apply the other microdevices.
- 社団法人 電気学会の論文
- 2004-02-01