Damage Free Dicing Method for MEMS Devices

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概要

• 論文の詳細を見る

• This paper presents a dicing method for MEMS devices without dameges during the dicing process. The method is based on bonding and detachment of a glass cap plate by using thermoplastic adhesive. Sand blast technique was used for the fabrication of glass cap plate which has concavities in the depth of 100µm. The thermoplastic adhesive was screen printed on the glass plate. The plate was thermocompression-bonded to silicon wafer at 210°C and diced to individual chips without damages from water or dicing dusts. The chip was mounted in the package while the glass cap was removed at 330°C.

• 社団法人 電気学会の論文
• 2003-07-01

著者

• Kato Kei

  Faculty Of Science And Technology Keio University

• MATSUMOTO Yoshinori

  Faculty of Science and Technology, Keio University

• AWATANI Yoshio

  Faculty of Science and Technology, Keio University

• Awatani Yoshio

  Faculty Of Science And Technology Keio University

• Matsumoto Yoshinori

  Faculty Of Science And Technology Department Of Applied Physics And Physico-informatics Keio Univers

• Matsumoto Yoshinori

  Faculty Of Science And Technology Keio University

関連論文

• Damage Free Dicing Method for MEMS Devices
• Fluidic-Based Inclination Sensor by Silica Coating Process with Low-Voltage Detection Circuitry

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