Effects of Reflow Processing and Flux Residue on Ionic Migration of Lead-Free Solder Plating Using the Quartz Crystal Microbalance Method

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2001-09-20

著者

• Yoshihara Sachio

  Graduate School Of Engineering Utsunomiya University

• Shirakashi Takashi

  Graduate School Of Engineering Utsunomiya University

• TANAKA Hirokazu

  Graduate School of Engineering, Utsunomiya University

• UETA Fumitaka

  Graduate School of Engineering, Utsunomiya University

• Ueta Fumitaka

  Graduate School Of Engineering Utsunomiya University

• Tanaka Hirokazu

  Graduate School Of Engineering Utsunomiya University

関連論文

• Effects of Reflow Processing and Flux Residue on Ionic Migration of Lead-Free Solder Plating Using the Quartz Crystal Microbalance Method
• Kalman Filter-Based Error Concealment for Video Transmission
• Effect of Additives in the Electrolyte on the Physical Properties of Electrodeposited Copper

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