Chip Bonding on Non-rigid and Flexible Substrates with New Stepped Processes
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概要
- 論文の詳細を見る
- Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
- 2001-01-15
著者
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Kim W
Information Display Research Center Korea Electronics Technology Institute
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Park S
Information Display Research Center Korea Electronics Technology Institute
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Han Jeong
Electronics Devices Research Center Korea Electronics Technology Institute
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PARK Sung
Electronics Devices Research Center, Korea Electronics Technology Institute
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KIM Won
Electronics Devices Research Center, Korea Electronics Technology Institute
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KWAK Min
Electronics Devices Research Center, Korea Electronics Technology Institute
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- タイトル無し
- Thermal Conductivity of AlO/Poly(vinyl butyral) Composites (Special Issue : Advanced Electromaterials)
- Chip Bonding on Non-rigid and Flexible Substrates with New Stepped Processes