Three-Dimensional Analysis of a Thermal Dissipation System with a Rectangular Diamond Heat Spreader on a Semi-infinite Copper Heat Sink

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概要

• 論文の詳細を見る
• Publication Office, Japanese Journal of Applied Physics, Faculty of Science, University of Tokyoの論文
• 1996-09-01

著者

• Tan Hong

  Microelectronics Center School Of Electrical And Electronic Engineering Nanyang Technological Univer

• HUI Ping

  Microelectronics Center, School of Electrical and Electronic Engineering, Nanyang Technological Univ

関連論文

• Three-Dimensional Analysis of a Thermal Dissipation System with a Rectangular Diamond Heat Spreader on a Semi-infinite Copper Heat Sink
• A Rigorous Series Solution for a Thermal Dissipation System with a Diamond Heat Spreader on an Infinite Slab Heat Sink

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