Mechanochemical Polishing of Si Wafer Using BaCO_3 Coated Lapping Tape

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概要

• 論文の詳細を見る
• 1998-09-30

著者

• Yasunaga N

  Tokai University

• Kitajima Koichi

  Kansai University

• NAKAI Masanori

  Kansai University

• TOTTORI Takaaki

  Nippon Ref-Lite Industry Co., Ltd.

• YASUNAGA Nobuo

  Tokai University

• SUZUKI Kiyoshi

  Nippon Institute of Technology

• Tottori Takaaki

  Nippon Ref-lite Industry Co. Ltd.

• Suzuki K

  Nippon Inst. Technol. Saitama

関連論文

• Mechanochemical Polishing of Si Wafer Using BaCO_3 Coated Lapping Tape
• Manufacturing of a porous PCD with skeleton structure by EDM
• New electrical discharge integrated grinding method using an electrically conductive diamond cutting edge grinding wheel
• Development of a fine grade PCD wheel for Precision and micro grinding using an ED-truing
• Electrical Discharge Machining Using Electrically Conductive CVD Diamond as an Electrode (第180回電気加工研究会)
• A New Dressing Method for Superabrasive Wheels Utilizing Magnetic Abrasive Polishing

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