GLP(Grinding-Like Polishing)Using Magnetic Fluid -Surface Polishing Characteristics of Silicon Wafer-

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概要

• 論文の詳細を見る
• 1996-06-30

著者

• KUROBE Toshiji

  Faculty of Engineering, Kanazawa University

• Suzuki Shigenari

  Faculty Of Engineering Kanazawa University

• HIROSAKI Kenichi

  Industrial Research Institute of Ishikawa

• SAKAYA Katsuaki

  Industrial Research Institute of Ishikawa

• Kurobe Toshiji

  Faculty Of Engineering Kanazawa University

関連論文

• Local Area Polishing of Glass for Profile Modificatory Polishing by Fine Pressure Control
• High Speed Machining of Bio-Titanium Alloy with a Binder-Less PcBN Tool(Advanced Manufacturing Technology)
• GLP(Grinding-Like Polishing)Using Magnetic Fluid -Surface Polishing Characteristics of Silicon Wafer-
• Improvements in controllability of ultrasonic linear motors by longitudinal-bending multilayered transducers with independent electrodes (Special issue: Ultrasonic electronics)
• High Speed Slurry Flow Finishing of Inner Wall of Stainless Steel Capillary - Effects of Slurry Injection Pressure on Polishing Performance -
• X-Ray Photoelectron Spectroscopy of Fluorocarbon Films Deposited by RF Sputtering

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