スポンサーリンク
The Ritsumeikan Trust, Kyoto 604-8520, Japan | 論文
- Effects of Pore Sealing on Self-Formation of Ti-Rich Barrier Layers in Cu(Ti)/Porous-Low-$k$ Samples
- Performance of Cu Dual-Damascene Interconnects Using a Thin Ti-Based Self-Formed Barrier Layer for 28 nm Node and Beyond