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Tanaka Kikinzoku Kogyo K.K. | 論文
- 最大泡圧法による溶融Cu-Sn系の表面張力測定
- Performance Investigation of Contact Material in 42VDC Automotive Relay (国際セッションIS-EMD2002〔英文〕)
- Influence of Electrical Load Conditions on Sticking Characteristics in Silver-Oxide Contacts(Special Issue on Current Electromechanical Devices and Their Materials with Recent Innovations)
- Special Section on Recent Development of Electromechanical Devices (Selected Papers from IS-EMD2005)
- Technical Trends on Electromechanical Devices (Special Issue on Recent Electromechanical Devices)
- Low-Temperature Wafer Bonding for MEMS Hermetic Packaging Using Sub-micron Au Particles