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Research and Development Initiative Chuo University | 論文
- Screening Life Cycle Assessment of Silver-Based Conductive Adhesive vs. Lead-Based Solder and Plating Materials
- Halofluorination of Alkenes Using Dilute Hydrofluoric Acid
- Silicon-Based Cross-Coupling Reactions Through Intramolecular Activation
- Assessing Long-term Reliability of Polymeric Housing Materials