スポンサーリンク
Matsushita Electric Industrial Co. Ltd. Device Engineering Development Center | 論文
- An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filters for Mobile Communication (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)
- A Beam Tilt Dipole Array Antenna for Indoor Mobile Applications (Special Issue on Microwave Devices for Mobile Communications)
- Organic Substrate and Flip-Chip Bonding on It Technology, "Chip on ALIVH" Suitable for GHz System Packaging