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Graduate school of Science and Engineering, Ehime University | 論文
- Addressing Defect Coverage through Generating Test Vectors for Transistor Defects
- Star-Forming Galaxies at z * 0.24 in the Subaru Deep Field and the Sloan Digital Sky Survey
- PCRによるスクーチカ症の原因繊毛虫 Miamiensis avidus の同定および検出
- PCRによるスクーチカ症の原因繊毛虫Miamiensis avidusの同定および検出
- Clustering Properties of Low-Luminosity Star-Forming Galaxies at z = 0.24 and 0.40 in the Subaru Deep Field
- Evaluation and 3D-Fem Analysis for Contact Strength of Ceramic Plate in Contact with a Round Bar
- E-14 EVALUATION AND 3D-FEM ANALYSIS FOR CONTACT STRENGTH OF CERAMIC PLATE IN CONTACT WITH A ROUND BAR(Session: Fatique/Contact Strength)
- Saturable Absorption of Glycerol in the Rat Intestine(Biopharmacy)
- Development of a Mobile Grading Machine for Citrus Fruit
- CREEP LIFE ASSESSMENT OF 2.25Cr-1Mo PIPING STEEL AND OF ITS SIMULATED HAZ MATERIAL
- Phase separation in the system with sodium silicate and sodium dodecyl sulfate under acidic conditions
- Zinc Ions Inhibit the Protein-DNA Complex Formation between Cyanobacterial Transcription Factor SmtB and its Recognition DNA Sequences
- Performance Evaluation of PRML System Based on Thermal Decay Model(Recent Progress of High-Density Information Storage)
- Performance Improvement of PRML System in Perpendicular Magnetic Recording Channel with Thermal Decay
- Performance Improvement of PRML System in Perpendicular Magnetic Recording Channel with Thermal Decay(Recording systems & heads (II),The 8th Asian Symposium on Information Storage Technology (ASIST-8))
- Performance Improvement of PRML System in Perpendicular Magnetic Recording Channel with Thermal Decay
- Effect of thermal imprinting conditions on fabricated micro/nano patterns in tin phosphate glass
- Study for the origin of fracture of advanced pore-free silicon carbide with damage tolerance
- Electronic Structure of Yttrium and Carbon Atoms Encapsulated Metallofullerenes, Y_2C_2@C_ : Ultraviolet Photoelectron Spectroscopy and Theoretical Calculation
- Mechanism of Generation and Suppression of Tin Whiskers on Tin and Tin-Lead Plated Films