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Fujikura Ltd. | 論文
- Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology(Microwaves, Millimeter-Waves)
- A Novel Chirped Fiber Bragg Grating Utilizing Thermal Diffusion of Core Dopant (Special Issue on Optical Fibers and Their Applications)
- Fabrication of Superconducting Y-Ba-Cu Oxide Through an Improved Diffusion Process : Electrical Properties Condensed Matter
- Thermal Performance of a Heat Pipe with Carbon Fiber Wick
- Suppression of Stimulated Brillouin Scattering by Intentionally Induced Periodical Residual-Strain in Single-Mode Optical Fibers (Special Issue on Optical Fiber Cables and Related Technologies)
- Critical Current Density of Y-Ba-Cu Oxide Wires
- Critical Temperature and Critical Current Density of La-Sr-Cu Oxide Wires
- Interface Effects on Tree Growth of Cross-linked Polyethylene
- Characteristics of Long-Period Fiber Grating Utilizing Periodic Stress Relaxation (Special Issue on Optical Fiber Sensors)
- 水素吸蔵LaNi_5合金の高温塑性と転位組織
- Research and Development of Long Heat Pipes and Their Applications
- On-Chip Yagi–Uda Antenna for Horizontal Wireless Signal Transmission in Stacked Multi Chip Packaging
- Characterization of Silicon Mach-Zehnder Modulator in 20-Gbps NRZ-BPSK Transmission