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Faculty Of Engineering Fukui University | 論文
- Isolation of Deoxycytidine Kinase from Ehrlich Carcinoma Cells by Affinity Chromatography Based on a Substrate Analog, 2'-C-Cyano-2'-deoxy-1-β-D-arabinofuranosyl-N^4-palmitoylcytosine
- Synthesis of Glycidyl Acrylate in Organic Solvents Catalyzed by Lipase
- Synthesis of D(+)-1-Phenylethyl Acrylate in Organic Solvents Catalyzed by Lipase and Its Polymer
- ポリビニルアルコ-ルとポリエチレンイミンの共重合体に固定したリパ-ゼによる有機溶媒中でアクリル酸エステル類の合成〔英文〕
- Antioxidative Activity of (-)-Epigallocatechin-3-(3"-O-methyl) gallate Isolated from Fresh Tea Leaf and Preliminary Results on Its Biological Activity
- セルロースおよび酢酸セルロースへのアゾ開始剤の固定とビニルモノマーのグラフト重合
- ELECTRON TRANSPORT COEFFICIENTS IN PURE C_3F_8 AND COLLISION CROSS SECTIONS OF C_3F_8 WITH LOW ENERGY ELECTRONS
- Synthesis of Citronellyl Acetate by Lipase Entrap-Immobilized in Cellulose Acetate-Zirconium Butoxide Gel Fiber
- A Multi-Layered Immune System for Graph Planarization Problem
- An Artificial Immune System with Feedback Mechanisms for Effective Handling of Population Size
- Bearingless Windmill-type Gas Flowmeter
- Atmospheric Pressure Measurement by Means of Variation of Boiling Point of Water
- A Near-Optimum Parallel Algorithm for a Graph Layout Problem(Neural Networks and Bioengineering)
- Ant Colony Optimization with Genetic Operation and Its Application to Traveling Salesman Problem
- Antiproton-nucleon Annihilation into π^oM and ηM with M=η, ω, ρ, and πin Antiproton-deuterium Annihilation at Rest : Elementary Particles and Fields
- A Genetic Algorithm with Conditional Crossover and Mutation Operators and Its Application to Combinatorial Optimization Problems(Neural Networks and Bioengineering)
- Learning Method of Hopfield Neural Network and Its Application to Traveling Salesman Problem (特集:論文誌C発刊30周年記念)
- Evidence for widespread infection of hepatitis E virus among wild rats in Japan
- Application of Dithiol Compounds in Supercritical Carbon Dioxide to Improve the Adhesive Properties of Copper-Plated p-Aramid Fibers
- Supercritical Fluid-assisted Electroless Copper Plating of Aramid Film : The Influence of Surface Treatment