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Dept. of Machine Intelligence and Systems Engineering, Tohoku Univ. | 論文
- TED-AJ03-219 HEAT TRANSFER MECHANISM BASED ON TEMPERATURE PROFILES AND BUBBLE MOTION IN MICROBUBBLE EMISSION BOILING
- Three-Dimensional Integration of Fully Depleted SOI Devices
- Filling of Tungsten into Deep Trench Using Time-Modulation CVD Method
- Deep Trench Etching in SOI Wafer for Three-Dimensional LSIs
- Development of the Three-Dimensional Integration Technology for Highly Parallel Image Processing Chip
- A New Wafer-Scale Chip-on-Chip (W-COC) Packaging Technology Using Adhesive Injection Method
- New SOI Flash Memory with Side Channel and Side Floating Gate
- S-34 Pregnancy outcome in women with false ^-positive screen for Down syndrome using second trimester maternal serum triple markers