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Dept. of Bioengineering and Robotics, Tohoku Univ. | 論文
- Intelligent Neural Implant Microsystem Fabricated Using Multi-Chip Bonding Technique
- Ultimate Functional Multi-Electrode System (UFMES) Based on Multi-Chip Bonding Technique
- Deep Trench Etching for Chip-to-Chip Three-Dimensional Integration