スポンサーリンク
Center for Microelectronic Systems, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan | 論文
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Fabrication of Back-Side Illuminated Complementary Metal Oxide Semiconductor Image Sensor Using Compliant Bump
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding
- Electrostatic Droplet Ejection Using Planar Needle Inkjet Head
- Low-Voltage-Signaling CMOS Receiver with Dynamic Threshold Control
- A Variable Channel-Size MOSFET with Lightly Doped Drain Structure
- CMOS Application of Single-Grain Thin Film Transistor Produced Using Metal Imprint Technology
- SOI-MOSFET/Diode Composite Photodetection Device
- Breakdown Voltage in Uniaxially Strained n-Channel SOI MOSFET
- Cross-Hatch Related Oxidation and Its Impact on Performance of Strained-Si MOSFETs
- CMOS Application of Schottky Source/Drain SOI MOSFET with Shallow Doped Extension
- Increased Emission Efficiency of Gated Cold Cathode with Carbonic Nano-Pillars
- Location Control of Si Thin-Film Grain Using Ni Imprint and Excimer Laser Annealing