HIGUCHI Toshiro | Department of Precision Engineering, School of Engineering, The University of Tokyo
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Department of Precision Engineering, School of Engineering, The University of Tokyo | 論文
- Study on Sn-Ag Oxidation and Feasibility of Room Temperature Bonding of Sn-Ag-Cu Solder
- Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air
- P-MNS-07 NANOTRANSFER METHOD FOR THE FERROELECTRIC FILMS ONTO THE POLYMER SUBSTRATE(Micro/Nanosystem Science and Technology,Technical Program of Poster Session)
- Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs with Au-Au Surface Activation
- Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evaluated by Micro Size Specimen