Jeong Seongcheol | Department of Nanomechanics, Graduate School of Engineering, Tohoku University

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概要

関連著者

Suzuki Ken
Fracture And Reliability Research Institute Graduate School Of Engineering Tohoku University
SUZUKI Ken
Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University
MIURA Hideo
Fracture and Reliability Research Institute (FRRI), Graduate School of Engineering, Tohoku University
Murata Naokazu
Department of Nanomechanics, Graduate School of Engineering, Tohoku University
Jeong Seongcheol
Department of Nanomechanics, Graduate School of Engineering, Tohoku University
Sato Yuki
Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University
SUZUKI Ken
Fracture and Reliability Research Institute (FRRI), Graduate School of Engineering, Tohoku University

著作論文

Effect of the Formation of the Intermetallic Compounds between a Tin Bump and an Electroplated Copper Thin Film on both the Mechanical and Electrical Properties of the Jointed Structures

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