OGAWA Koichi | Matsushita Electric Industrial Co., Ltd., Device Engineering Development Center
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- Matsushita Electric Industrial Co., Ltd., Device Engineering Development Centerの論文著者
Matsushita Electric Industrial Co., Ltd., Device Engineering Development Center | 論文
- Organic Substrate and Flip-Chip Bonding on It Technology, "Chip on ALIVH" Suitable for GHz System Packaging
- An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filters for Mobile Communication (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functioions and Size-Reductions)