Lee Kwon-Woo | Package Development, Memory Division, Semiconductor, Samsung Electronics Co., Ltd.
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概要
Package Development, Memory Division, Semiconductor, Samsung Electronics Co., Ltd. | 論文
- The Optimization of Passivation Layout Structure for Reliability Improvement of Memory Devices
- Thermal Fatigue Life Prediction of Gull-Wing Solder Joints in Plastic Thin Small Outline Packages