KURINO H. | Department of Machine Intelligence and System Engineering, Tohoku University
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Department of Machine Intelligence and System Engineering, Tohoku University | 論文
- New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method
- Cell Cycle-dependent Modulation of Promoter Activities of RB and WAF1/Cip1 Genes
- Polyimide Optical Waveguide with Multi-Fan-Out for Multi-Chip Module Application
- Osteogenic Protein-1 (Osteogenic Protein-1/Bone Morphogenetic Protein-7) Inhibits Degeneration and Pain-Related Behavior Induced by Chronically Compressed Nucleus Pulposus in the Rat
- Early Complications of High-Dose Methylprednisolone Sodium Succinate Treatment in the Follow-Up of Acute Cervical Spinal Cord Injury