Hong Won | Physics of Failure Research Center, Korea Electronics Technology Insititute

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• Hong Won Sikの詳細を見る
• 同名の論文著者
• Physics of Failure Research Center, Korea Electronics Technology Insitituteの論文著者

Physics of Failure Research Center, Korea Electronics Technology Insititute | 論文

• 421 LIFE PREDICTION OF SN-AG-CU SOLDER JOINTS WITH SURFACE FINISH UNDER LONG TERM THERMAL STRESS CONDITION(4th JWS-KWJS Young Reseacher Symposlum)

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