Hirose Akinori | Dept. of Machine Intelligence and System Engineering, Tohoku University
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- HIROSE Akinoriの詳細を見る
- 同名の論文著者
- Dept. of Machine Intelligence and System Engineering, Tohoku Universityの論文著者
Dept. of Machine Intelligence and System Engineering, Tohoku University | 論文
- Development of the Three-Dimensional Integration Technology for Highly Parallel Image Processing Chip
- A New Wafer-Scale Chip-on-Chip (W-COC) Packaging Technology Using Adhesive Injection Method
- New Three-Dimensional Wafer Bonding Technology Using Adhesive Injection Method
- Signal Propagation Characteristics in Polyimide Optical Wave-guide with Micro-Mirrors for Optical Multichip Module
- Signal Propagation Characteristics in Polymide Optical Waveguide with Micro-Mirrors for Optical Multichip Module