Wu Y. | Dept. Of Machine Intelligence And Systems Engineering Akita Prefectural University

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概要

• WU Y.の詳細を見る
• 同名の論文著者
• Dept. Of Machine Intelligence And Systems Engineering Akita Prefectural Universityの論文著者

関連著者

• Wu Y.

  Dept. Of Machine Intelligence And Systems Engineering Akita Prefectural University

• WU Y.

  Dept. of machine intelligence and systems engineering, Akita prefectural university

• KATO M.

  Dept. of machine intelligence and systems engineering, Akita prefectural university

• FAN Y.

  Dept. of machine intelligence and systems engineering, Akita prefectural university

• Tachibana T.

  Micron machinery Co., Ltd.

• Tachibana T.

  Micron Machinery Co. Ltd.

• Fan Y.

  Dept. Of Machine Intelligence And Systems Engineering Akita Prefectural University

• Sato T.

  Dept. Vet. Sci., Fac. Agri., Tottori Univ.

• Nomura M.

  Dept. of Intern. Med., Fujita Gakuen Univ. School of Med.

• Syoji K.

  School of engineering, Tohoku university

• Kuriyagawa T.

  School of engineering, Tohoku university

• Kuriyagawa T.

  School Of Engineering Tohoku University

• Syoji K.

  School Of Engineering Tohoku University

• Liang Z.

  School Of Mechanical And Vehicular Engineering Beijing Institute Of Technology:dept. Of Machine Inte

• WANG X.

  School of Mechanical and Vehicular Engineering, Beijing Institute of Technology

• Zhao W.

  School of Mechanical and Vehicular Engineering, Beijing Institute of Technology

• LIN W.

  Dept. of machine intelligence and systems engineering, Akita Prefectural University

• Zhao W.

  School Of Mechanical And Vehicular Engineering Beijing Institute Of Technology

• Wang X.

  School Of Materials Science And Engineering Shanghai Jiao Tong University

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著作論文

• Controlling the Workpiece Rotation Speed with an Ultrasonic Regulator in Microscale Centerless Grinding(M^4 processes and micro-manufacturing for science (continued))
• 211 Design of the Ultrasonic Elliptic-vibration Shoe and its Performance in Ultrasonic Elliptic-vibration Shoe Centerless Grinding
• 128 Fundamental Investigation of Internal Ultrasonic Vibration Assisted Grinding of Small Holes
• E11 Two-dimensional Ultrasonically Assisted Grinding of Monocrystal Silicon(Grinding technology)

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