SAKUMA K. | Dept. of Machine Intelligence and System Engineering, Tohoku University

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概要

• SAKUMA K.の詳細を見る
• 同名の論文著者
• Dept. of Machine Intelligence and System Engineering, Tohoku Universityの論文著者

関連著者

• KURINO H.

  Dept. of Machine Intelligence and Systems Engineering, Tohoku University

• KOYANAGI M.

  Dept. of Machine Intelligence and Systems Engineering, Tohoku University

• SAKUMA K.

  Dept. of Machine Intelligence and System Engineering, Tohoku University

• Kurino H.

  Dept. Of Machine Intelligence And System Engineering Tohoku University

• Kurino H.

  Department Of Machine Intelligence And System Engineering Tohoku University

• Koyanagi M.

  Dept. Of Machine Intelligence And System Engineering Tohoku University

• Sakuma K.

  Dept. Of Machine Intelligence And System Engineering Tohoku University

• Koyanagi M.

  Dept. Biophys. Facl. Sci. Kyoto Univ.

• NAKAMURA T.

  Dept.of Orthop.Surgery, Faculty of Medicine, Kyoto University

• Lee K.

  Dept. Of Electronic Engineering Yonsei University

• Lee K.

  Dept. Of Machine Intelligence And System Engineering Tohoku University

• Lee K.

  Dept. Advanced Mater. Eng. Korea Advanced Inst. Of Sci. & Tech. Seoul

• MIYAKAWA N.

  Fuji Xerox Co.

• ITANI H.

  Mitsubishi Heavy Industry Co.

• KOYANAGI M.

  Dept. of Machine Intelligence and Systems Engineering, Tohoku Univ.

• Hashimoto H.

  Dept. Obst. Gynec., Nara Med. Univ.

• Park K.

  Dept. Of Hort. Sci. College Of Natural Resources Korea Univ.

• Matsumoto T.

  Dept. Obst. and Gynec., Tsu National Hosp.

• SATOH M.

  Dept. of Machine Intelligence and System Engineering, Tohoku University

• Matsumoto T.

  Dept. Obst. And Gynec. Tsu National Hosp.

• Koyanagi M.

  Department Of Machine Intelligence And System Engineering Tohoku University

• Matsumoto T.

  Dept. Obst. And Gynec. Kurume Univ. Sch. Med.

• Park K.

  Dept. Of Machine Intelligence And System Engineering Tohoku University

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著作論文

• Development of the Three-Dimensional Integration Technology for Highly Parallel Image Processing Chip
• A New Wafer-Scale Chip-on-Chip (W-COC) Packaging Technology Using Adhesive Injection Method
• New Three-Dimensional Wafer Bonding Technology Using Adhesive Injection Method

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