IKEDA Mayumi | Department of Materials Science and Engineering, Faculty of Engineering, Kumamoto University

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概要

• Ikeda Mayumiの詳細を見る
• 同名の論文著者
• Department of Materials Science and Engineering, Faculty of Engineering, Kumamoto Universityの論文著者

関連著者

• SHIMIZU Isao

  Department of Applied Chemistry, School of Science and Engineering, Waseda University

• Shimizu I

  Advanced Research Institute For Science And Engineering Waseda University

• Ohno Yasuhide

  Department Of Materials Science And Engineering Faculty Of Engineering Kumamoto University

• Shimizu Isao

  Department Of Applied Chemistry Graduate School Of Science And Engineering Waseda University

• Shimizu Isao

  Department Of Materials Science And Engineering Faculty Of Engineering Kumamoto University

• Shimizu Isao

  Department Of Applied Chemistry School Of Science And Engineering Waseda University

• NOGUCHI Kunihiro

  Department of Mechanical System, Kumamoto Technical College

• IKEDA Mayumi

  Department of Materials Science and Engineering, Faculty of Engineering, Kumamoto University

• Ikeda Mayumi

  Department Of Materials Science And Engineering Faculty Of Engineering Kumamoto University

• Noguchi Kunihiro

  Department Of Materials Science And Engineering Faculty Of Engineering Kumamoto University

• NAKAMORI Takashi

  Nippon Steel Corp.

• Noguchi Kunihiro

  Kumamoto University

• Ikeda Mayumi

  Kumamoto University

• Nakamori Takashi

  Kumamoto University

• NOGUCHI Kunihiro

  Graduate School of Science and Technology, Kumamoto University

• IKEDA Mayumi

  Graduate School of Science and Technology, Kumamoto University

• KAWAMURA Yoshito

  Department of Materials Science and Engineering, Faculty of Engineering, Kumamoto University

• Kawamura Yoshito

  Department Of Materials Science And Engineering Faculty Of Engineering Kumamoto University

• Kawamura Yoshito

  Department of Chemistry, Faculty of Science, Hokkaido University

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著作論文

• Influence of Shear Height on Shear Strength of Tin-Lead Solder Ball Bonding
• 416 Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonded by Various Cooling Rates
• Effect of Cooling Rate on Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonding

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