Hasegawa K | Muroran Inst. Technol. Muroran Jpn
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概要
関連著者
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Hasegawa K
Muroran Inst. Technol. Muroran Jpn
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Hasegawa Koji
Muroran Institute Of Technology
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Hasegawa K
Muroran Institute Of Technology
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Koshiba Masanori
Graduate School Of Engineering Hokkaido University
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INAGAWA Kiyoshi
Tomakomai National College of Technology
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HASEGAWA Koji
Kushiro National College of Technology
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Hiramatsu M
Nano Factory Graduate School Of Science And Technology Meijo University
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Kimura Shingo
Department Of Physics School Of General Education Iwate Medical University
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Hiramatsu Makoto
Memory Products Business Promotion Center Canon Inc.
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Ishii K
Nanoelectronics Research Institute National Institute Of Advanced Industrial Science And Technology
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Kimura S
Ntt Photonics Lab. Kanagawa Jpn
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Hasegawa Koichi
Faculty Of Engineering Kanagawa University
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Kimura S
Central Research Laboratory Hitachi Ltd.
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ISHII Kazuyoshi
Memory Products Business Promotion Center, Canon Inc.
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MIYAOKA Yasuyuki
Memory Products Business Promotion Center, Canon Inc.
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KIMURA Syunpei
Memory Products Business Promotion Center, Canon Inc.
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MIYAJIMA Yoshikazu
Memory Products Business Promotion Center, Canon Inc.
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TACHIBANA Shinichi
Memory Products Business Promotion Center, Canon Inc.
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HASEGAWA Koyo
Memory Products Business Promotion Center, Canon Inc.
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Ishii Ken'ichi
Electrotechnical Laboratory
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TSUJINO Jiromaru
Faculty of Electrical Engineering, Kanagawa University
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MORI Takahiro
Faculty of Textile Science & Technology, Shinshu University
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Tsujino Jiromaru
Faculty Of Electrical Engineering Kanagawa University
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Hiramatsu M
Toshiba Corp. Yokohama Jpn
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Miyaoka Yasuyuki
Memory Products Business Promotion Center Canon Inc.
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Miyajima Yoshikazu
Memory Products Business Promotion Center Canon Inc.
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Tachibana S
Tenjinkai New Koga Hospital Kurume Jpn
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Mori Takahiro
Department Of Biology Faculty Of Science Toho University
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Koshiba Masanori
Department Of Electronics Faculty Of Engineering Hokkaido University
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Hasegawa Koji
Department of Cardiovascular Medicine, Graduate School of Medicine, Kyoto University
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Hasegawa Koji
Department Of Cardiovascular Medicine Graduate School Of Medicine Kyoto University
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INAGAWA Kiyoshi
Department of Electronic Engineering, Faculty of Engineering, Hokkaido University
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Koshiba Masanori
Department Of Electronic Engineering Faculity Of Engineering Hokkaido University
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ONOZATO Takashi
Faculty of Engineering, Kanagawa University
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Hasegawa Koji
Department Of Biology College Of Liberal Arts Kagoshima University
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Koshiba Masanori
Department Of Electronic And Information Engineering Hokkaido University
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Onozato Takashi
Faculty Of Engineering Kanagawa University
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Hasegawa Koji
Department Of Applied Chemistry Nagoya Institute Of Technology
著作論文
- Coefficients of Coupled-Mode Equations for Interdigital Transducers with Solid Electrodes of Gold, Silver, Tantalum, or Tungsten Alloy on a 50°Y-25°X La_3Ga_5SiO_ Substrate
- Coefficients of Coupled-Mode Equations for Reversal of Directivity Transducers on a 50〓Y-25〓XLa_3Ga_5SiO_Substrate
- Analysis of an Electrode-Width-Difference-Reversal-of Directivity Transducer on a La_3Ga_Nb_O_ Substrate
- Coefficients of Coupled-Mode Equations for a Natural-Single-Phase-Unidirectional Transducer and an Electrode-Width-Difference-Reversal-of-Directivity Transducer on a 50°Y-24°X La_3Ga_5SiO_Substrate
- Parameters of Coupling-of-Modes Equations for a Natural Single-Phase-Unidirectional Transducer on a La_3Ga_Nb_O_Substrate
- Parameters in the Coupling-of-Modes Equations for a Natural Single-Phase Unidirectional Transducer and a Transduction Center Shift Reversal of Directivity Transducer on a La_3Ga_5SiO_ Substrate
- An Analysis of Excitation Characteristics of Interdigital Transducers for Surface Acoustic Waves : SAW and Communication Devices
- Large-Capacity and High-Speed Magnetic Field Modulation Recording for 3.5" Magneto-Optical Disk Drive : Drive Technology
- Large-Capacity and High-Speed Magnetic Field Modulation Recording for 3.5" Magneto-Optical Disk Drive
- Welding Characteristics of Ultrasonic Wire Bonding Using High-Frequency Vibration Systems
- Welding Characteristics of Ultrasonic Wire Bonding Using High-Frequency Vibration Systems