Lee H | Korea Advanced Inst. Of Sci. And Technol. Taejon Kor
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概要
関連著者
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Lee H
Korea Advanced Inst. Of Sci. And Technol. Taejon Kor
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Lee Hyuck
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Lee Hyuck
Department Of Materials Science And Engineering Kaist
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KIM Jong
Department of Chemical Engineering, Dong A University
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JEONG Sang
Department of Physiology, College of Veterinary Medicine, Konkuk University
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Jeong S
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Kim Jong
Department Of Agricultural Chemistry Faculty Of Agriculture Kyoto University
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Kim Jong
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Jeong Sang
Department Of Dermatology And Division Of Brain Korea 21 Project For Biomedical Science Korea Univer
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Kim Jong
Department Of Agricultural Bio-resources National Academy Of Agricultural Science Rural Development
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YOON Seung
Advanced Package Development Support, Institute of Microelectronics (IME)
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BAE Jun
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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SOH Jeong
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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KIM Sun
Stainless Steel Department, Technical Research Laboratory, Pohang Steel Company
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LEE Yong
Stainless Steel Department, Technical Research Laboratory, Pohang Steel Company
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Bae Jun
Department Of Biotechnology Taegu University
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Yoon Seung
Advanced Package Development Support Institute Of Microelectronics (ime)
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Kim S
Sung Kyun Kwan Univ. Suwon Kor
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Lee Y
Stainless Steel Department Technical Research Laboratory Pohang Steel Company
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Soh Jeong
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Bae Jun
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Jeong Sang
Department of Chemical Engineering, Chungbuk National University
著作論文
- Abnormal Grain Growth of Ni_3Sn_4 at Sn-3.5Ag/Ni Interface
- Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy
- Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications
- Diffusional Solidification Behavior in 304 Stainless Steel