Kim Do-Seop | Department of Mechanical Engineering and Materials Science, Yokohama National University
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- Department of Mechanical Engineering and Materials Science, Yokohama National Universityの論文著者
Department of Mechanical Engineering and Materials Science, Yokohama National University | 論文
- Ferrite and copper electroless plating to photopolymerized resin for micro molding of three-dimensional structures
- Ferrite and copper electroless plating of photopolymerized resin for micromolding of three-dimensional structures
- Electoroless and electrolytic plating of photopolymerized resin for use in the micro-moldintg of three dimensional nickel structures
- Micro molding of three-dimensional metal structures by electroless plating of photopolymerized resin
- The Mechanism of Thermo-Induced Electrostatic Image Formation in Poled Ferroelectric Polymer Films