Kim Jung-Gu | Department of Advanced Materials Science and Engineering, Sungkyunkwan University
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概要
Department of Advanced Materials Science and Engineering, Sungkyunkwan University | 論文
- A New Non-PRM Bumping Process by Electroplating on Si Die for Three Dimensional Packaging
- Channel Strain Measurement of Si_C_x Structures : Effects of Gate Length, Source/Drain Length, and Source/Drain Elevation