Kim Sang-Hoon | 論文著者

Advanced Technology Team, Advanced Circuit Interconnection Division, Samsung Electro-Mechanics Co., Ltd., 314 Maetan 3-dong, Yeongtong-gu, Suwon, Gyunggi-do 443-743, Republic of Korea

Center for Information Storage Device (CISD), Yonsei University, Shinchon-dong, Seodaemoon-ku, Seoul 120-749, Korea

Center For Information Storage Device Yonsei University

Center for Information Storage Device, 332D, YERC, Yonsei University, 134, Shinchon-dong, Seodaemoon-ku, Seoul 120-749, Korea

Center for Information Storage Device, Yonsei University

Center for Information Storage Device, Yonsei University, 134 Shinchon-dong, Seodaemun-gu, Seoul 120-749, Korea

Center for Information Storage Device, Yonsei University, 134 Shinchon-Dong, Sudaemoon-Ku, Seoul 120-749, Korea

Computer Science Department, KAIST

Department of Electrical and Electronic Engineering (C-724), College of Engineering, Yonsei University, 134 Shinchon-dong, Seodaemoon-ku, Seoul 120-749, Korea

Department of Electrical and Electronic Engineering, College of Engineering, Yonsei University, 134 Shinchon-dong, Seodaemoon-ku, Seoul 120-749, Korea

Department of Electrical and Electronic Engineering, Yonsei University

Department of Electrical and Electronic Engineering, Yonsei University, Seoul 120-749, Korea

Department of Internal Medicine, Eulji University College of Medicine

Department Of Mechanical Engineering Korea Advanced Institute Of Science And Technology

Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology

Department of Mechanical Engineering, Yonsei University, Shinchon-dong, Seodaemoon-gu, Seoul 120-749, Korea

Imaging Media Research Center

Pohang University of Science and Technology, Pohang, Gyeongbuk 790-784, Korea

School of Life Sciences and Biotechnology, Korea University

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