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The Conference of Photopolymer Science and Technology | 論文
- Thin Film Block Copolymer Assembly in Mixtures of Highly Selective Solvents
- Low Temperature Deposition of Cu Thin Film on Polyimide Using RF-driven Atmospheric Pressure Plasma Jet in Nitrogen Atmosphere
- Spin-on Glass as Perpendicular Orientation Control Layer for Block Copolymer
- A Study on Surface Modification of Soluble Block Copolymer Polyimide by UV Irradiation and Its Application to Electroless Plating
- Approach for High Aspect Ratio Pattern Transfer by Nanoimprint Lithography using Mixture Polymers of Molecular Weights
- Palladium Catalyzed Vinyl Addition Poly(norbornenes) : Formic Acid as a Chain Transfer Agent : Mechanism and Polymer Optical Properties
- Fabrication of Functional Membrane with Activated Ester via Plasma-Induced Graft Polymerization
- Thermal Imprint of P3HT and PCPDTBT : Layer Preparation and Imprint Temperature
- Generation of Three-Dimensionally Integrated Micro Solution Plasmas and Its Application to Decomposition of Organic Contaminants in Water
- Fullerene Nanowires Produced by Single Particle Nanofabrication Technique and Their Photovoltaic Applications
- Filterability of Block Copolymer Solutions used for Directed Self Assembly Lithography
- Hybrid UV Curing System Using Methacrylates Having a Chalcone Moiety
- Alicyclic Polyimides Derived from Alkanone Bis-spironorbornanetetracarboxylic Dianhydrides
- Ambipolar Low-bandgap Copolymers Consisting of Dithienoketopyrrole for All-Polymer Solar Cells
- Development of Polymer Blend Solar Cells Composed of Conjugated Donor and Acceptor Polymers
- Arbitrary Patterning onto Inner Surfaces of Small-Diameter Pipes Using Laser Scan Lithography
- High Sensitive Photopolymerization Initiator System using Violet Laser and Its Application to Photopolymer CTP Plate
- Immobilization of Cyclodextrin Derivatives onto the Self-Assembled Phospholipid Layer Fabricated by Plasma-Assisted Method
- Fabrication of Dye-sensitized Solar Cells Using Electrostatic Inkjet Printing
- Electrical Via Chain Yield for DSA Contact Hole Shrink Process