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概要
論文 | ランダム
- Shear Fracture Behavior on Ball Grid Arrayed Tin-Silver-Copper Solder/Pure Copper Pad Joint Interface
- Influence of Shear Height on Shear Strength of Tin-Lead Solder Ball Bonding
- 416 Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonded by Various Cooling Rates
- Effect of Cooling Rate on Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonding
- 比例および非比例繰返し負荷のもとでの硬化/軟化挙動を記述できる粘塑性構成式の定式化