Effect of Post-Thermal Annealing of Thin-Film Transistors with ZnO Channel Layer Fabricated by Atomic Layer Deposition
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概要
- 論文の詳細を見る
We investigated zinc oxide (ZnO) thin films fabricated by atomic layer deposition (ALD) for their application in thin-film transistors (TFTs). The fabricated TFTs were annealed at various temperatures in various ambient gases. The characteristics of TFTs annealed in oxygen ambient at the temperature of up to 400 °C indicated improvements with no degradation of subthreshold swing or large shift in threshold voltage. From the annealing temperature dependences of transfer characteristics and X-ray diffraction patterns, we found that the improvements in electrical characteristics are attributed to the crystalline modification of ZnO films. The TFTs annealed at 400 °C in O2 ambient indicate improved stability against the bias stress. Secondary ion mass spectrometry analysis revealed a marked decrease in the hydrogen concentration of the ZnO channel layer after the annealing at 400 °C.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2010-04-25
著者
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Horita Masahiro
Graduate School Of Materials Science Nara Institute Of Science And Technology
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Uraoka Yukiharu
CREST, Japan Science and Technology Agency, 4-1-8 Honcho, Kawaguchi, Saitama 332-0012, Japan
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Yukiharu Uraoka
CREST, Japan Science and Technology Agency, Honcho, Kawaguchi, Saitama 332-0012, Japan
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Kawamura Yumi
Graduate School of Materials Science, Nara Institute of Science and Technology, 8916-5 Takayama, Ikoma, Nara 630-0192, Japan
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Yumi Kawamura
Graduate School of Materials Science, Nara Institute of Science and Technology, 8916-5 Takayama, Ikoma, Nara 630-0192, Japan
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Masahiro Horita
Graduate School of Materials Science, Nara Institute of Science and Technology, 8916-5 Takayama, Ikoma, Nara 630-0192, Japan
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