Gettering in Large-Grained Thin Polycrystalline Silicon Films on Glass Substrate
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概要
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Large-grained polycrystalline silicon (poly-Si) films on a glass substrate are good candidate materials for fabricating poly-Si thin-film transistors (TFTs) and poly-Si solar cells. The gettering of metal impurities in thin poly-Si films is one of the key techniques for realizing high-performance, high-reliability, and high-efficiency TFTs and solar cells. In this study, the gettering of large-grained thin poly-Si films with a thickness of 100 nm containing Ni impurities was studied. A large-grained Ni-doped thin poly-Si film was fabricated on a glass substrate by Ni-induced solid phase crystallization (SPC) followed by cw green laser recrystallization. The grain size of the poly-Si film was $1 \times 10$ μm2. The behavior of Ni impurities in the large-grained thin poly-Si film was evaluated by scanning transmission electron microscopy (STEM), STEM energy-dispersive X-ray spectroscopy (STEM–EDX), and electron diffraction (ED) analysis. It was observed that Ni was stabilized through the formation of nickel-disilicide (NiSi2) at the triple junction during low-temperature device fabrication.
- 2010-01-25
著者
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HARA Akito
Tohoku Gakuin University
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Hara Akito
Tohoku Gakuin University, Tagajo, Miyagi 985-8537, Japan
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Sato Tsutomu
Tohoku Gakuin University, Tagajo, Miyagi 985-8537, Japan
関連論文
- Gettering in Large-Grained Thin Polycrystalline Silicon Films on Glass Substrate
- Self-Aligned Planar Metal Double-Gate Polycrystalline-Silicon Thin-Film Transistors Fabricated at Low Temperature on Glass Substrate
- Self-Aligned Planar Metal Double-Gate Polycrystalline-Silicon Thin-Film Transistors Fabricated at Low Temperature on Glass Substrate