Effect of Amine Additive in Photoacid Generator Bonded Resist for Extreme Ultraviolet and Electron Beam Lithography

概要

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Amine additive compounds play an important role in obtaining high sensitivity and low line edge roughness (LER) in photoacid generator (PAG)-bonded resists. It was confirmed that the PAG-bonded resist improved sensitivity and LER simultaneously with an amine additive. High sensitivity and low LER can be achieved simultaneously by optimizing the amine compound ratio in a PAG-bonded resist system. By optimizing the contents of the PAG and the amine compound ratio, the resolution was improved up to 40 nm. The sensitivity and LER of a 40 nm line/space (L/S) pattern of the PAG-bonded resist were 26 μC/cm2 and 4.9 nm ($3\sigma$), respectively. Furthermore, by loading the PAG, a sensitivity of 16 μC/cm2 was achieved for a 60 nm L/S pattern. The $E_{0}$ sensitivity was 1.75 mJ/cm2 under extreme ultraviolet (EUV) exposure. It was also confirmed that the PAG-bonded resist has high sensitivity under EUV exposure.
2009-06-25