Direct Micro Fabrication of Flexible Copper Clad Laminate Using 355 nm UV Laser

概要

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In the study for this paper, the 355 nm UV laser was used to modify and to deposit copper patterns onto a polyimide surface. The UV laser breaks chemical bonds and causes chemical reactions to occur on the irradiated surface due to photochemical effects and to photothermal effects. More specifically, the polyimide surface is initially modified using the UV laser and the copper is then deposited directly by the UV laser from the copper formate solution. The polyimide surface was transformed into an oxygen-rich surface by modification and copper traces were deposited on the polyimide surface. The smallest pattern was obtained at a laser fluence of 600 mJ/cm2 and a scan speed of 4.3 mm/s. The maximum thickness was 8.5 μm and the width was 55 μm. While the thickness and the width of the deposited copper traces decreased in accordance with the scan speed of the laser, the surface of the deposited copper traces is extremely rough. Furthermore, the copper had C and O impurities. The resistivity of copper traces was minimum $1.07 \times 10^{-6}$ $\Omega$$\cdot$m.
2008-08-25