Effect of Back Mold Grooves on Improving Uniformity in Nanoimprint Lithography

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概要

• 論文の詳細を見る

• The nanoimprint technique has the advantages of high throughput, sub-10-nm resolution and low cost. However, the nonuniform surface obtained in practice raises concerns about the quality of pattern transfer. In this study, we present a uniform printing method across a wafer by introducing a local mold deformation along the block boundary. This method is simple and effective: it involves cutting grooves on the back of the mold within the nonpatterned area. The grooves enable the mold to lie easily on the substrate with a close fit to obtain a more uniform pattern over a large surface. The proposed method was demonstrated experimentally.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2007-09-30

著者

• Hsu Wei

  Department Of Chemical Engineering National Taiwan University Taipei

• Hocheng Hong

  Department Of Power Mechanical Engineering National Tsing Hua University

• Hocheng Hong

  Department of Power Mechanical Engineering, National Tsing Hua University, 101, Section 2 Kuang Fu Road, Hsinchu, Taiwan 30013, R.O.C.

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