On-Die Monitoring of Substrate Coupling for Mixed-Signal Circuit Isolation
スポンサーリンク
概要
- 論文の詳細を見る
In this paper, we report an on-chip high-frequency substrate coupling measurement technique that uses the frequency translation of a mixer. It realizes the practical evaluation of substrate coupling isolation structures in the presence of off-chip parasitic impedance caused by assembly. A design flow of the technique to be embedded in a chip includes circuit design, substrate coupling modeling and analysis, and system-level simulation. Test chips in 0.35 μm complementary metal oxide semiconductor (CMOS) technology demonstrate the feasibility of on-chip measurement-based substrate coupling evaluation, along with excellent consistency with simulations.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2007-04-30
著者
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Kosaka Daisuke
Department Of Computer And Systems Engineering Kobe University
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Danjo Takumi
Department Of Computer And Systems Engineering Kobe University
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Fujiwara Masaki
Department Of Computer And Systems Engineering Kobe University
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Nagata Makoto
Department Of Computer And Systems Engineering Kobe University
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Nagata Makoto
Department of Computer and Systems Engineering, Kobe University, 1-1 Rokkodai-cho, Nada-ku, Kobe 657-8501, Japan
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Fujiwara Masaki
Department of Computer and Systems Engineering, Kobe University, 1-1 Rokkodai-cho, Nada-ku, Kobe 657-8501, Japan
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Kosaka Daisuke
Department of Computer and Systems Engineering, Kobe University, 1-1 Rokkodai-cho, Nada-ku, Kobe 657-8501, Japan
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Danjo Takumi
Department of Computer and Systems Engineering, Kobe University, 1-1 Rokkodai-cho, Nada-ku, Kobe 657-8501, Japan
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Fujiwara Masaki
Department of Chemical Engineering, Toyama University
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