Dependence of CoSi2 Sheet Resistance on Cobalt Thickness for Gate Lengths of 50 nm or Less
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概要
- 論文の詳細を見る
In this paper, we report a novel process for reducing a large distribution of sheet resistance ($R_{\text{s}}$) of CoSi2 with a low resistivity of 18 μ$\Omega$ cm [O. Akhavan et al.: Appl. Sur. Sci. 233 (2004) 123] in narrow lines by establishing a simple model for explaining the dependence of $R_{\text{s}}$ on the gate length ($L_{\text{g}}$). We prove that the distribution of $R_{\text{s}}$ is mainly influenced by the shape of the high resistivity (147 μ$\Omega$ cm) cobalt monosilicide (CoSi) phase [A. Applebaum et al.: J. Appl. Phys. 57 (2005) 1880] formed in the first rapid thermal annealing (RTP-1) in the salicide process, and demonstrate that a tight distribution of $R_{\text{s}}$ for $L_{\text{g}}=30$ nm can be achieved by optimizing the cobalt thickness to enhance the transformation to CoSi2.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2006-05-15
著者
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KAWAMURA Kazuo
Fujitsu Laboratories Ltd.
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Saiki Takashi
Fujitsu Limited Advanced Lsi Development Div.
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Kawamura Kazuo
Fujitsu Ltd., Fuchigami 50, Akiruno, Tokyo 197-0833, Japan
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Nakamura Ryo
Fujitsu Ltd., 50 Fuchigami, Akiruno, Tokyo 197-0833, Japan
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Saiki Takashi
Fujitsu Ltd., Fuchigami 50, Akiruno, Tokyo 197-0833, Japan
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