A New Surface Modification Method to Prevent the Release-Stiction of Micromechanical Structures during HF Vapor-Phase Etching
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概要
- 論文の詳細を見る
A novel release process without stiction problem is a major concern in surface micromachining technology to fabricate microelectromechanical systems (MEMS) devices. HF vapor-phase etching (VPE) has been focused as a promising dry process to remove sacrificial SiO2 layer, but still has limitation due to water condensation. We have first demonstrated the effectiveness of a new surface modification method using strongly hydrophilic materials (i.e., Ti, Al2O3) in preventing the release-stiction during HF VPE process. The role of hydrophilic surface layer is proposed to suppress the water bridging causing a attractive capillary force between micromechanical and stationary structures.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-09-15
著者
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Kim Yoon
Electric And Magnetic Devices Research Group Korea Electrotechnology Research Institute
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Yang Woo
Electronics And Telecommunications Research Institute
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Yang Woo
Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon 305-350, Korea
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Jung Sung
Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon 305-350, Korea
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Kang Sung
Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon 305-350, Korea
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Lee Jaewoo
Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon 305-350, Korea
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Kim Yoon
Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon 305-350, Korea
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