Skew Ion-Bombardment-Induced Microstructure and Magnetic Anisotropy Evolutions in the Immiscible Co–Cu System during Deposition Process
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概要
- 論文の詳細を見る
Co–Cu alloy films with a metastable fcc structure were prepared using the ion beam assisted deposition (IBAD) technique at various ion incidence angles. The films prepared at the ion incidence angles of 15° to 60° showed the {220} out-of-plane texture and in-plane magnetic anisotropy. The fcc phase and hcp phase were obtained in the samples prepared at 75° and glancing incidence angle. It was regarded that the microstructure and magnetic anisotropy evolutions with variations of the ion incidence angle result from three main effects induced by ion interaction, i.e., ion mixing effect, channeling effect and enhancing effect of atomic migration in the ion incidence plane.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-11-15
著者
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Pan Feng
Laboratory Of Advanced Materials Department Of Materials Science And Engineering Tsinghua University
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Zeng Fei
Laboratory Of Advanced Materials Department Of Materials Science And Engineering Tsinghua University
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Zeng Fei
Laboratory of Advanced Materials, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, People's Republic of China
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Gao Yang
Laboratory of Advanced Materials, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, People's Republic of China
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Fan Yuwei
Laboratory of Advanced Materials, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, People's Republic of China
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Pan Feng
Laboratory of Advanced Materials, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, People's Republic of China
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