Particle Detection for Patterned Wafers Using Hybrid Optical-Digital Image Processing

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概要

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• A particle detection method for patterned wafers has been developed. This method achieves much better sensitivity by using hybrid optical-digital image processing. Optical image processing employs newly developed 45° diagonal illumination combined with spatial frequency filtering, to reveal the presence of particles with minimal loss of light energy. Digital image processing is characterized by a two-chip comparison procedure insensitive to positional mismatching between the two chips, and eliminates residual pattern information which could not be completely eliminated by optical image processing alone. This method is performed so as to detect 0.5 $\mu$m particles on patterned wafers.

• INSTITUTE OF PURE AND APPLIED PHYSICSの論文
• 1989-11-20

著者

• Akiyama Nobuyuki

  Production Engineering Research Laboratory Hitachi Ltd.

• Nakata Toshihiko

  Production Engineering Research Laboratory Hitachi Ltd.

• Akiyama Nobuyuki

  Production Engineering Research Laboratory, Hitachi, Ltd., 292 Yoshida-cho, Totsuka-ku, Yokohama 244

• Nakata Toshihiko

  Production Engineering Research Laboratory, Hitachi, Ltd., 292 Yoshida-cho, Totsuka-ku, Yokohama 244

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• Particle Detection for Patterned Wafers Using Hybrid Optical-Digital Image Processing

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