Development of Buried Fine-line Inductors Fabricated in LTCC by Thick Film Photolithography

概要

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Thick film photolithography enables finer line and space resolution compared to the conventional thick film process and a similar level of packaging density can be achieved when compared to thin film or etched thick film circuits. Because of the better line-edge definition than that of the screen-printed line, improved characteristics can be obtained at RF and microwave frequencies. In this paper, small size, fine line inductors buried in LTCC were fabricated by thick film photolithography. Photosensitive silver conductor paste was developed, which could be matched with the shrinkage of low temperature co-fired glass-ceramic composite. The test coupon showed line and space resolution below 30 μm and clear edge definition compared with screen-printed patterns. Buried inductors with fine lines were fabricated using the developed photosensitive silver paste and measured by a network analyzer. Inductance at 100 MHz, self-resonant frequency, and the quality factor of buried fine-line inductors were calculated from the measured data. Small-size, fine-line buried inductors showed reliable inductance and quality factor, and enabled the miniaturization of the LTCC body.
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