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The thermal deformations of electronic package, SOJ (Small Outline J-Leaded Package), were measured by phasc-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase shifter to obtain the displacement fields with the sensitivity of 100nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The thermal strains were then investigated with the two packages before and after mounted on PWB (Printed Wiring Board). The results showed that the strains increased about 50% after mounted on the PWB.
- 日本実験力学会の論文
日本実験力学会 | 論文
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