Direct formation of conductor films by laser sublimating of ceramics.
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概要
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A new method for direct writing of conductor lines onto ceramic substrates is presented. This method consists of forming metal thin film composed of aluminum by sublimating aluminum nitride (AlN) ceramics in Ar gas atmosphere with a Q-switched yttrium aluminum garnet (YAG) laser. Thickness of this film was about 0.5 μm. The specific resistance was about 5×10<SUP>-6</SUP>Ω·m. This metal layer was also available to electroless plating as a catalyst. With nickel (Ni) electroless plating solution, the Ni conductor lines of a specific resistance about 1×10<SUP>-7</SUP> Ω·m were directly band selectively formed on the aluminum layer. The bonding strength between the plated film and AlN substrate was above 9.8 MPa (1 kgf/mm<SUP>2</SUP>).
- 一般社団法人 日本機械学会の論文
一般社団法人 日本機械学会 | 論文
- PREFACE
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