Crystal Growth and Microstructure of Gold Layers Electrodeposited on the Planes of Copper Single Crystals:Studies on Gold Plating (Part 5)

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Limited thickness of the single crystal growth of electrodeposited gold layers on (110) plane of copper was examined by means of X-ray. In addition, the microstructure of gold films electrodeposited on (001), (110), (111), and (123) surfaces of copper was examined by electron microscopy and the selected area diffraction. The results were compared with those published for gold films formed by vacuum evaporation. Considerable similarities were found between the above two types of films.Many {111} twins were observed in all types of gold films electrodeposited on copper single crystals and the directions of the twins conformed to the crystallographic relation. The density of these twins was of the order of 108/cm2-1010/cm2, their width was in the range of 80-2, 000Å, and their length was in the range of 100-5, 000Å.Double positioning boundaries were observed in the films deposited on (111) and(123) surfaces. In the thin film deposited on (123) surface, many dislocations were observed around the double positioning boundaries, and the dislocation densities were of the order of 4×109-1×1010/cm2.
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