Electrolytic Polarization of Copper in Cyanide Plating Baths Consisting of CuCN-NaCN-Na2CO3 and of CuCN-KCN-K2CO3 under Stirred and Unstirred Conditions:Electrodeposition of Copper from Cyanide Bath and Polarization Phenomena (Part 2)

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• The present study was to investigate the behavior characteristics of the cathode polarization in the plating baths consisting either of CuCN-NaCN-Na2CO3 or of CuCN-KCN-K2CO3.When the solution was kept unstirred, the cathode current densities of the hydrogen evolution were found to be greater in the solution of potassium salt than that of sodium salt. Consequently, cathode polarization was less in the potassium salt solution than the corresponding sodium salt at the low current density range.The cathode polarization of copper deposition decreased considerably when the solution was stirred, and the current densities of the hydrogen evolution increased. In the potassium salt solution, more pronounced effect was observed than in the sodium salt solution.The marked influence of the stirring in reducing cathode polarization suggests that the polarization is solely controlled by diffusion. In all cases, however, the change of the mole ratio, [CN]/[Cu], of the constituents in the vicinity of the cathode must be taken into account.The fact that the effect of stirring in reducing the polarization was more pronounced in the bath of potassium salts than that of sodium salts led us to the following conclusion:There seem to exist the characteristic differences in the mechanism of the electrode processes during the deposition of copper on the cathode depending on the constiluent of copper cyanide solution of sodium or potassium salt.

• 社団法人 表面技術協会の論文

社団法人 表面技術協会 | 論文

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• 自動車用エンジン部品の表面技術と環境対策
• プリント配線基板で発生するイオンマイグレーションと信頼性解析
• イオン交換体の設計と輸送現象
• 半導体膜の低温成長

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