Shape detection of solder joints by spotlight scanning light-section method.
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概要
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This paper describes a shape detection method for solder joints of flat-packaged devices loaded on a circuit board. Flat-packaged devices are widely used for high density loaded boards for application in large computers, etc. For automating the visual inspection of the solder joints, a laser-spot scanning light-section method has been newly developed.In this method, a laser spotlight is projected from a vertical direction, and is detected from an oblique direction where a view-field is limited to a vertical line which includes the projected spotlight. The spotlight and the view-field are codeflected by a Galvano mirror which is located at a co-focuspoint of two Fourier transform lenses.This method enables a stable shape detection without a detection error by mirror-like reflection at solder surfaces which are often caused by a conventional slit-projecting light-section method.The structure of a detecting head and some examples of detected shapes are also described. Detected shape clearly indicates the deference between good and bad solder joints. Detection time is about 0.2s/35mm stroke.
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